Principal Electrical Lead

Cambridge Terahertz

Location: Sunnyvale, CA   |   Full-Time

Cambridge Terahertz, Inc. is a pioneering semiconductor company that transforms terahertz imaging into a practical, real‑time threat detection platform. Using custom silicon phased arrays, sophisticated digital signal processing, and AI‑driven analytics, the company delivers a compact, wireless system capable of pinpointing concealed weapons and contraband for airports, transportation hubs, and high‑traffic venues worldwide.

Principal Electrical Lead – Role Overview

Cambridge Terahertz seeks a seasoned Electrical Engineer to lead the electrical architecture and hardware development of its first‑in‑class THz radar imaging system. The principal electrical lead will sit at the intersection of research, design, and production, shaping the electrical and RF subsystems that enable sub‑millimeter penetration, high‑resolution imaging, and real‑time threat classification.

Key Responsibilities

  • Lead Electrical System Design: Own the end‑to‑end design of the printed circuit board (PCB) stack‑up, power distribution network (PDN), RF front‑end, and signal‑path routing for a high‑performance THz imaging sensor. Translate system‑level requirements into detailed schematic, board, and layout specifications that satisfy noise, power, thermal, and packaging constraints.
  • Cross‑Functional Integration: Collaborate closely with RF, firmware, and software teams to ensure that the electrical architecture aligns with system requirements, firmware expectations, and software‑driven processing pipelines. Drive design reviews and provide technical guidance on component selection and signal‑integrity tradeoffs.
  • Prototype Development & Validation: Oversee the fabrication of prototype boards, set up test benches, and orchestrate functional, performance, and environmental validation tests. Lead root‑cause analysis, debugging, and iterative refinement to ensure prototypes meet or exceed performance specifications.
  • Manufacturing & Quality Enablement: Partner with external manufacturers, quality engineers, and supply chain partners to transition prototypes to small‑volume production. Define design for manufacturability (DFM) rules, component qualification strategies, and test‑plan development to ensure a smooth scale‑up from lab to product.
  • Technical Road‑Mapping & Documentation: Co‑author long‑term electrical‑engineering road‑maps that capture evolving technology trends, component availability, and cost‑optimization pathways. Prepare detailed technical documentation – design specifications, bill of materials (BOM), and change logs – to support future engineering and procurement activities.
  • Leadership & Mentoring: Lead a small team of electrical engineers, fostering knowledge transfer and technical mentorship. Champion a culture of engineering excellence, continuous improvement, and rigorous documentation.
  • Compliance & Certification: Manage all activities that support regulatory compliance (CE, FCC, RoHS), safety certification (EN 55032, EN 61000‑4‑2), and industry standards. Prepare necessary submissions and coordinate with third‑party labs and certification bodies.

Required Technical Skills

  • Bachelor’s, Master’s, or PhD in Electrical Engineering, Computer Engineering, or related field; extensive experience (≥8 years) in high‑frequency PCB design, RF front‑end design, and system‑level electrical architecture.
  • Proven mastery of schematic capture, PCB layout (Altium Designer, Cadence Allegro, KiCad), and signal‑integrity simulation tools (ADS, HFSS, AWR).
  • Deep familiarity with RF/mixed‑signal ICs, power‑management ICs, high‑density connectors, and high‑speed serial interfaces (PCIe, JESD204, LVDS).
  • Experience with analog and digital signal‑processing in the THz or mmWave domain, including low‑noise amplifier design, mixer, LO distribution, and phased‑array beam‑forming architectures.
  • Comfortable with simulation tools for electromagnetic modeling, HFSS, or CST, and for thermal analysis.
  • Strong programming skills (Python or MATLAB) for scripting and automation in the design workflow.
  • Solid understanding of compliance and certification processes – experience preparing submission packages for FCC, CE, RoHS, and safety tests.
  • Excellent written and verbal communication; ability to articulate complex technical concepts to cross‑functional stakeholders.

Ideal Candidate Profile

The ideal individual is a forward‑thinking electrical engineering leader who thrives in a seed‑stage startup environment. They possess a blend of technical rigor and entrepreneurial drive, capable of translating abstract design goals into tangible hardware that can be validated in a lab and then delivered to production. A proven track record in designing complex RF/analog and system‑level PCB solutions for high‑speed imaging or communications platforms is essential. The candidate should exhibit a collaborative mindset and be comfortable leading a small engineering team while managing multiple stakeholders—hardware suppliers, firmware developers, product managers, and external certification labs.

Beyond technical competence, the ideal candidate is a natural mentor, actively fostering talent development and knowledge transfer. They are adaptable, resourceful, and comfortable making decisions under tight timelines, all while maintaining an unwavering focus on quality and reliability. A passion for safety, a commitment to inclusive hiring practices, and a desire to build a safer world through innovative technology should drive their day‑to‑day work.

If you are a seasoned electrical systems architect who is ready to shape the future of terahertz imaging, drive the hardware strategy of a high‑growth startup, and lead a team that will set the standard for next‑generation security screening, Cambridge Terahertz invites you to apply and join us on this exciting mission.

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About

Cambridge Terahertz, Inc. is a fast‑growing semiconductor firm that harnesses the power of terahertz (THz) imaging to bring airport‑grade security into everyday life. The company was founded in 2020 by a team of MIT alumni who recognized the unique advantages of THz waves: they penetrate clothing, plastics, and other non‑metallic materials while delivering high‑resolution, three‑dimensional imagery that is impossible to generate with conventional millimeter‑wave or infrared sensors. By fusing cu ...
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Post Date: September 22, 2025